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Media releases about Isotherm AG to download/print as PDF files.


The rear foaming of substrates is a patent pending process developed between BASF Group, Elastogran GMBH and Isotherm AG, Switzerland.

Polyurethane encapsulation for the protection of sensitive electronics

MANY DIFFERENT PLASTICS and processes are used to encapsulate and protect the sensitive inner workings of electronic devices. Thanks to a new technology, it is now possible to combine the encapsulation of the electronics and the production of the housing in a single step. Only one material is needed, namely polyurethane, as this product is ideally equipped to meet the many stringent specifications that relate, for example, to the mechanical and thermal properties.


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